Electronic Potting Compound

FOB Price

US $12.80
200 - 40,000 kilogram
US $8.90
40,001 - 999,999 kilogram

group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY-9055 Electronic Potting Compound
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:35:21 GMT

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Paramtents

Color Gray
Mixing ratio 1:1
Pot life 2-3 hours
Curing time 20 hours
HS. Code 39100000
Payment terms 100% T/T, L/C
Delivery time within 3 days after payment confirmed
Shelf life 12 months
Package 20 kg/drum
Sample available

Packging & Delivery

Min Order200 kilogram

Briefing

- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

Detailed

HY-9055 Electronic Potting Compound

Product Feature
HY-9055# is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The flame retardant UL94-V0 level can be achieved. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

Typical Application

HY-9055# is suitable for

- high powered electronics,

- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

Technical Parameters

Features		Part A	Part B
Before Curing	Appearence	Gray Fluid	White Fluid
	Viscosisty(25°Ccps)	3000±500	3000±500
Operation features	Mixing Ratio	1,1
	Viscosisty(after mixing) (cps)	2500~3500
	Operating Time(25°C hr)	120
	Curing time (min,25°C)	480
	Curing time(80°C hr)	20
After Curing	Hardness(Shore A)	55±5
	Thermal conductivity [W(m·K)]	≥0.8
	Dielectric Strength(KV/mm)	≥25
	Permittivity(1.2MHz)	3.0~3.3
	Volume Resisivity(Ω·cm)	≥1.0×10¹⁶
	linear expansibility [m/(m·K)]	≤2.2×10^-4
	Fire Resistance	94-V0

(Pls note, the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers to when using.)

Electronic Potting Compound

TECHNICAL GUIDELINES

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Weight Ratio, part A, part B = 1,1

3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.

4, The temperature influences the curing time of HY-9060#. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. Suggested operation time and temperature. With temperature of 80~100°C, the silicone will cure in 15 minutes, while in 25°C room temperature, the silicone will cure around 8 hours.

Warm Tips:
1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas.

l Condensation silicone which not completely cured or organic tin compounds

l Sulphur, sulfide and sulfur rubber materials.

l Amine compounds as well as contains the amine materials.

l Pewters solder flux.

2. Should be sealed storage.The mixture should be used up at once, avoid causing waste.

3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes.

4. When it gets stratified after a period of storage, Please mix 9060 evenly before using, it does not affect the performance.

PACKAGE
20Kg/pail (Part A10Kg + Part B10Kg)

SHELF LIFE AND TRANSPORTATION

1. Twelve(12) months from date of shipment when stored at 24C in original unopened packages.

2. This kind of product is non-dangerous product, it can be transported as general chemicals.

3. Products exceed the storage life should be confirmed normal before using.

Any further information, please feel free to contact Ms. Judy

MOBILE:086-18938867591

QQ: 18938867591

Skype: judy.zhao723