electronic controller/pcm for li-ion/li-polymer/lifepo4 battery pack/motion activated sound module
group namePrinted Circuit Board(PCB)
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Min Order1 piece
brand nameXing Da
modelelectronic controller
payment methodT/T, D/P D/A, MoneyGram, PayPal, Westem Union
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update timeFri, 19 Jul 2013 15:26:47 GMT
Paramtents
Base Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crock
Copper Thickness 1/2 oz min; 12 oz max
Board Thickness 0.2mm-6mm(8mil-126mil)
Min. Hole Size 0.1mm(4mil)
Min. Line Width 0.075mm(3mil)
Min. Line Spacing 0.1mm(4mil)
Surface Finishing HASL / HASL lead free, Chemical tin, Chemical Gold
Packging & Delivery
Min Order1 piece
Briefing
Detailed
Shenzhen Xindaxing electronic controller/pcm for li-ion/li-polymer/lifepo4 battery pack/motion activated sound module Shenzhen Xindaxing Electric Technology Co., Ltd.
(Xing Da Electric Technology Co.,Ltd),which has been specializing in PCB/PCBA and Electronic components for many years.
We can prvide a package of service:
· 1. PCB layout, PCB design;
· 2: Make high difficulty PCB(1 to 38 layers)
· 3: Provide all Electronic components;
· 4: PCB assembly;
· 5: Write programs for clients;
· 6: PCBA/finished product Test.
· etc…
Specification for PCB Manufacture:
Item | Specification |
Numbr of Layer | 1-38Layers |
Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery |
Metal-backed Laminate | |
Remarks | High Tg CCL Is Availabe(Tg>=170ºC) |
Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
Minimun Core Thickness | 0.075mm(3mil) |
Copper Thickness | 1/2 oz min;12 oz max |
Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
Min.Hole Diameter for punching | 0.9mm(35mil) |
Biggest panel size | 610mm*508mm |
Hole Positon | +/-0.075mm(3mil) CNC Driling |
Conductor Width(W) | +/-0.05mm(2mil)or |
+/-20% of original artwork | |
Hole Diameter(H) | PTH L:+/-0.075mm(3mil) |
Non-PTH L:+/-0.05mm(2mil) | |
Outline Tolerance | +/-0.125mm(5mil) CNC Routing |
+/-0.15mm(6mil) by Punching | |
Warp & Twist | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test Voltage | 10-300V |
Panel Size | 110×100mm(min) |
660×600mm(max) | |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
6 layers:0.25mm(10mil)max | |
Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
6 layers:+/-0.15mm(6mil) | |
Impedance Control | +/-10% |
Different Impendance | +-/10% |
Detailed terms for PCB Assembly
Technical requirement
1)Professional surface-mounting and Through-hole soldering technology
2)Various sizes like 1206,0805,0603 components SMT technology
3)ICT (In Circuit Test),FCT (Functional Circuit Test ) technology
4)PCB Assembly with VL.CE.FCC.Rohs Approval
5)Nitrogen gas reflow soldering technology for SMT
6)High standard SMT&Solder Assembly Line
7)High density interconnected board place ment technology capacity
Quote requirement
1)genber file and Bom list
2)clear pics of PCBA or PCBA Sample for us
3)Test Method for PCBA
Our majoy customers:
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