CERAMIC fiber INORGANIC BOARD

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Packging & Delivery

The boards have lower shot content, lower thermal conductivity.The product doesn’t have any organic binder.

Features

Without any organic bond

No smoking non-black surface, no smell when heating

Thickness of 3~100mm

Low shrinkage, and excellent stability

Low thermal conductivity excellent thermal performance

High strength, excellent Machining performance

Can be used on hot face, direct contact fire

Excellent thermal shock resistance

Typical Applications

Insulation material for household appliances

Surface lining to avoid thermal radiation

Insulation material for household appliances such as gas boiler

Typical Parameters

CERAMIC FIBER BOARD	1100-BOARD	1260- BOARD	1300- BOARD	1350- BOARD	1430- BOARD
Physical properties	Classification Temperature(℃)	1100	1260	1300	1350	1430
	Bulk Density (kg/m³)	300/320/360
	Water Content(%)	≤ 1
	Cold Crushing Strength(MPa)	0.1-0.3
	Organic Material Content(%)	0
	Permanent Liner Change (%)	950℃X24h≤ -3	1000℃X24h≤ -3	1100℃X24h≤ -3	1200℃X24h≤ -3	1350℃X24h≤ -3
Chemcial Analysis (%)	Al₂O₃	≥40	≥43	44-47	51-53	-
	Al₂O₃+SiO₂	≥95	≥96	≥98	≥99	-
	Al₂O₃+SiO₂++ ZrO₂	-	-	-	-	99
	ZrO₂	-	-	-	-	≥15
	Fe₂O₃	＜0.5	＜0.5	≤0.3	≤0.3	-
	K₂O+Na₂O+ Fe₂O₃	＜0.9	-	-	-	-
Thermal Conductivity (W/mK)	200℃	0.08	0.07	0.07	0.08	0.08
	400℃	0.12	0.11	0.11	0.11	0.11
	500℃	0.13	0.13	0.13	0.13	0.13
	600℃	0.11	0.10	0.15	0.10	0.10