potting and encapsulaton silicone rubber for electronic parts

                                 Encapsulant and Potting silicone

Applications of Encapsulant and Potting silicone:

Encapsulant and Potting silicone is applicable to sealing, bonding and coating for electronic parts. Filling for LED, LCD electronic display, circuit board.

Description of Encapsulant and Potting silicone:

HY-210#Encapsulant and Potting silicone is two-component room temperature vulcanization silicone rubber, which has low viscosity, easy mixing and pouring, is applicable to bulk pouring with excellent electrical performance.

Standard Datasheet of Encapsulant and Potting silicone:

Model HY-210# Encapsulant and Potting silicone Type

Gel-type Components  A   B

Appearance  (liquid) black / transparent / white yellowy

Mixing ratio   100 5

Viscosity (Pa.s)     5000

Pot life(25C) (mins)  20 - 30

Curing time (mins)    2 - 4

Hardness shore A    25 ± 2

Tensile strength (Mpa)  0.5 - 1.5

Elongation at break (%)  30 - 50

Dielectric strength (kv/m-1)  20

Specific inductive capacity(1MHz)  2.8 - 3.2

Breakdown voltage (KV.mm-1)  16

Volume resistivity ()  1×1014

Dielectric loss factor (1MHz)  1×10-3

Features of Encapsulant and Potting silicone:

HY-210# Encapsulant and Potting silicone has sticky viscosity, low shrinkage and non-corrosive;

the HY-210# Encapsulant and Potting silicone can be used for a long period at the temperature of -60C-200C with the characteristics of moisture-proof and waterproof, radiation-proof as well as weatherable and anti-ageing.

Using Instructions of Encapsulant and Potting silicone:

1. Clean and dry the electronic element to be poured;

2. Mix the component A (silicone) and component B(hardener) evenly according to the proportion, and can be poured after deaired the bubbles. The surface will cure in about 2-4 hours after pouring.

More information need about our HY-868# silicone sealant, please feel free to contact with Miss Sarah

Tel: 0086-755-89948013

Moible: 0086-13620974715