200 - 40,000 kilogram
40,001 - 999,999 kilogram
group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY-9055# silicone rubber
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:33:46 GMT
MOQ 200kg
Payment T/T L/C Western union
Color Any color
Package 25kg/drum 200kg/drum
FOB Price US$10-18.5
Features liquid
Port shenzhen
Hs code 39100000
Certifications RoHS, MSDS, SGS, ISO9001:2000
Min Order200 kilogram
Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Features & Applications
Addition cure encapsulant and potting compound for thermal conductivity HY-9055# is a two-component silicone rubber with low viscosity, which can be cured both at room temperature and high temperature.
Addition cure encapsulant and potting compound for thermal conductivity HY-9055# works on the surface of material as PC(Poly-carbonate), PP, ABS, PVC as to its superior bonding feature, and it is also applicable for insulation, waterproof, bonding of electronics parts.
Addition cure encapsulant and potting compound for thermal conductivity HY-9055# meets the requirements of European RoHs.
Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Typical Application
- High-power electronic component.
- Power module and printed circuit board request thermal conductivity and high temperature.
Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Technical Parameters
Properties index | Part A | Part B | |
Before Curing | Appearence | Dark Grey fluid | White fluid |
Viscosity (cps) | 2500+/-500 | 2500+/-500 | |
Features when operation | Mixing Ratio ( By weight) | 1:1 | |
Viscosity after Curing(cps) | 2000~3000 | ||
Operating Time (hr) | 2 | ||
Curing time ( hr, room temperature) | 8 | ||
Curing time ( min, 80C) | 20 | ||
Hardness(shore A) | 55+/-5 | ||
After Curing | Thermal Conductivity[W( m·K)] | ≥0.8 | |
Dielectric Strength( kV/mm) | ≥25 | ||
Dielectric permittivity(1.2MHz) | 3.0~3.3 | ||
Volume resistivity(Ω·cm) | ≥1.0×1016 | ||
Linear Dilatation[m/( m·K)] | ≤2.2×10-4 | ||
Fire Resistance | 94-V1 |
(Pls note all datas of addition cure encapsulant and potting compound for thermal conductivity HY-9055# above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions, or when data was regenerated).
Warm Tips
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-9055# evenly before using,
it does not affect the performance.
4. HY-9055# won’t be cured when mixed with some chemical material, so pls avoid contacting the following chemical materials
A. Organice tin compounds and silicone rubber with organotin
B. Materials with sulfur, sulfide
C. Materials with amine
Package
10kg/set (Part A 5kg + Part B 5kg)
40kg/set (Part A 20kg + Part B 20kg)
Shelf Life and Transportation
1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.
Any more information abt Addition Cure Encapsulant and Potting Compound , pls feel free to contact Ms.Bella
Mob: 0086-18938867572
Tel: 0086-755-89948006
Fax: 0086-755-89948030
Email: hysi (at) szrl (dot) net
Skype: bellajiaqi
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