Electronic Encapsulation and Heat-Eliminating Silicone Gel

FOB Price

US $15.23
200 - 40,000 kilogram
US $7.62
40,001 - 999,999 kilogram

group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY9055#
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:34:27 GMT

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Paramtents

color white
certifications RoHS.MSDS.SGS ISO9001:2000
operation way pouring
hardness 55 shore A
Viscosisty (after mixing) (cps) 2000~3000
Operating Time (25℃ min) 120
Curing time (min, 25℃) 480
Thermal conductivity [W(m.K)] ≥0.8
Fire Resistance 94-V0

Packging & Delivery

Min Order200 kilogram

Briefing

Electronic Encapsulation and Heat-Eliminating Silicone Gel
circuit board
high temperature resistance.
SGS
fire resistance

Detailed

Applications of Electronic Encapsulation and Heat-Eliminating Silicone Gel

Electronic Encapsulation and Heat-Eliminating Silicone Gel is addition cure silicone potting compound in two parts with low viscosity.

It can be cured completely at room temperature. It works on the surface of material as PC(Poly-carbonate),PP,ABS,PVC as to its superior bonding feature. It is also applicable for insulation, waterproof and bonding of electronics parts. It meets the requirements of European RoHS.

Electronic Encapsulation and Heat-Eliminating Silicone Gel

Key Features of Electronic Encapsulation and Heat-Eliminating Silicone Gel
Oiltight, the fluidity and heat conduction property can be adjusted with requirement, non-
toxic and eco-friendly.

model		HY-9055	HY-9060	HY-9300
Before Curing	Appearance	A: Dark gray fluid B: White fluid liquid	A: Dark gray fluid B: White fluid liquid	A: Transparent fluid B: Colorless and transparent fluid liquid
Before Curing	Viscosity cP	A: 2500±500 B: 2500±500	A: 3000±500 B: 3000±500	A: 600±200 B: 1800±200
Operating Performance	A:B(w/w)	1:1	1:1	1:1
	Mixing Ratio cP	2000~3000	2500~3500	600~1000
	Pot life min	120	120	3h
	Curing time (25°C) min	480	480	480(could be cured both at room temperature and cured by heating.20mins at 80-100°C is suggested)
	Curing time (80°C)min	20	20	20
After Curing	Hardness (Shore A)	55±5	60±5	0
	Thermal conductivity w/mK	≥0.8	≥0.8	≥0.2
	Absolute degree Of dielectric kv/mm	≥25	≥25	≥25
	Permittivity kv/mm	3.0~3.3	3.0~3.3	3.0~3.3
	Volume Resistanc Ω·cm	≥1.0×10¹⁴	≥1.0×10¹⁴	≥1.0×10¹⁴
	Linear expansion coefficient /mK	≤2.2×10^-4	≤2.2×10^-4	≤2.2×10^-4
	Flame Resistance	UL94-V0	UL94-V0	UL94-V0