Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055#

FOB Price

US $9.80
200 - 40,000 kilogram
US $6.80
40,001 - 999,999 kilogram

group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
model9055#
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:42:05 GMT

contact supplier

Paramtents

color as request
Packages 25kgs and 200kgs per drum
Application For moulds making
certificate RoHS, MSDS, SGS, ISO9001:2000
appearance liquid
sample available
mix ratio 1:1
hardness 55 shore A
operation time 30-45 mins under tempreature 25 degrees
shelf life 8-10 month

Packging & Delivery

Min Order200 kilogram

Briefing

Addition Cure Encapsulant and Potting Compound
Low shrinkage
Favorable tension
No deformation
Favorable hardness

Detailed

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Features & Applications

Addition cure encapsulant and potting compound for thermal conductivity HY-9055# is a two-component silicone rubber with low viscosity, which can be cured both at room temperature and high temperature.

Addition cure encapsulant and potting compound for thermal conductivity HY-9055# works on the surface of material as PC(Poly-carbonate), PP, ABS, PVC as to its superior bonding feature, and it is also applicable for insulation, waterproof, bonding of electronics parts.

Addition cure encapsulant and potting compound for thermal conductivity HY-9055# meets the requirements of European RoHs.

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055#

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Typical Application

- High-power electronic component.

- Power module and printed circuit board request thermal conductivity and high temperature.

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055# Technical Parameters

Properties index		Part A	Part B
Before Curing	Appearence	Dark Grey fluid	White fluid
	Viscosity (cps)	2500+/-500	2500+/-500
Features when operation	Mixing Ratio ( By weight)	1:1
	Viscosity after Curing(cps)	2000~3000
	Operating Time (hr)	2
	Curing time ( hr, room temperature)	8
	Curing time ( min, 80C)	20
	Hardness(shore A)	55+/-5
After Curing	Thermal Conductivity[W( m·K)]	≥0.8
	Dielectric Strength( kV/mm)	≥25
	Dielectric permittivity(1.2MHz)	3.0~3.3
	Volume resistivity(Ω·cm)	≥1.0×10¹⁶
	Linear Dilatation[m/( m·K)]	≤2.2×10^-4
	Fire Resistance	94-V1

(Pls note all datas of addition cure encapsulant and potting compound for thermal conductivity HY-9055# above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions, or when data was regenerated).

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055#

Warm Tips

1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-9055# evenly before using,
it does not affect the performance.

4. HY-9055# won’t be cured when mixed with some chemical material, so pls avoid contacting the following chemical materials

A. Organice tin compounds and silicone rubber with organotin

B. Materials with sulfur, sulfide

C. Materials with amine

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055#

Package
10kg/set (Part A 5kg + Part B 5kg)

40kg/set (Part A 20kg + Part B 20kg)

Shelf Life and Transportation

1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.

Addition Cure Encapsulant and Potting Compound for Thermal Conductivity HY-9055#