100 - 40,000 kilogram
40,001 - 999,999 kilogram
group nameelectronic potting silicone rubber
Min Order100 kilogram
brand nameHong Ye silicone rubber
modelElectronic Potting Compound(silicone encapsulants)
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:45:38 GMT
Color black , gray , translucent
Certificate UL V94-0
Shape Pasty
Package Vacuum Pumping
Shelf Life 12 months
MOQ 200 kg
delivery within 3 days after payment
payment terms T/T, L/C
Min Order100 kilogram
Electronic Potting liquid silicon rubber
1,Product Feature of Electronic Potting liquid silicon rubber
Electronic Potting liquid silicon rubber is a kind of low viscosity, Inherent flame resistance, two components (1:1mixing ratio)addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.
2,Typical Application of Electronic Potting liquid silicon rubber
-----High powered electronics encapsulation
-----DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
-----It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
3,Standard datasheet(25 °C):
Model | HY-9055 | HY-9060 | HY-9300 | HY-9301 | ||||||
Appearance | Part A | Part B | Part A | Part B | Part A | Part B | A Part A | Part B | ||
Gray fluid
| White fluid
| Gray fluid | White fluid | Transparent | Transparent | Black | Transparent | |||
Before Curing | Viscosisty(cP) | 2500±200 | 2400±200 | 3000±500 | 2700±200 | 600 ± 200 | 800 ± 200 | 2500 ± 200 | 2300 ± 200 | |
Operation Features | Part A:Part B (by weight) |
1:1
|
1:1 |
1:1 |
1:1 | |||||
Mixed viscocity(cP) | 2000~3000 | 2500-3500 | 600-1000 | 2000-3000 | ||||||
Operation time(min) | 120 | 120 | 180 | 300 | ||||||
C Curing time(hrs,25°C) | 8 | 8 | 8 | 8 | ||||||
Curing time(min,80°C) | 20 | 20 | 20 | 30 | ||||||
After Curing | Hardness( A) | 55±5 | 55±5 | 0 | 0 | |||||
Thermal conductivity [W(m·K)] | ≥0.8 |
≥0.8 |
≥0.2 |
≥0.3 | ||||||
Dielectric Strength (KV/mm) | ≥25 | ≥25 | ≥25 | ≥25 | ||||||
Permittivity (1.2MHz) | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | ||||||
Volume Resisivity (Ω·cm) | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ||||||
Linear expansibility [m/(m·K)] | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ||||||
Fire Resistance | 94-V1 | 94-V0 | 94-V1 | 94-V1 | ||||||
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