easy to operate addition silicone for electronic compound

FOB Price

US $16.20
200 - 40,000 kilogram
US $8.90
40,001 - 999,999 kilogram

group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY9055
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:52:56 GMT

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Paramtents

color white
sample available
HS code 39100000
feature liquild
normal packing 25kgs per drum
shelf life one year
MOQ 200kgs
delievy within 3 days
certifaicate RoHS MSDS SGS ISO9001:2008

Packging & Delivery

Min Order200 kilogram

Briefing

Addition thermal conducted silicone :
1.low shrinkage
2.no deformation
3.good operation

Detailed

Specifications of high grade addition silicone for electronic compound

Addition silicone for electronic compound use for various electronic components, and then forming insulation system with no corrosion and negligible shrinkage.

Typical Application of high grade addition silicone for electronic compound

Addition silicone for electronic compound is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

Product Feature of high grade addition silicone for electronic compound

It can be applied to the sealing and pouring of various electronic components, and then forming insulation system with no corrosion and negligible shrinkage.

(Pls note: the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.
The appearance can be adjusted by our technical department if required.)

TECHNICAL GUIDELINES of high grade addition silicone for electronic compound

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Weight Ratio: part A: part B = 1:1

3, Deaeration the mixture under 0.08 MPa for 3 minutes.

4, The temperature influences the curing time of 9301. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.

Technical Parameters of Addition silicone for electronic compound

Specification		Part A	Part B
Before Curing	Appearance	Dark Grey Fluid	White Fluid
	Viscosity(cps)	2500±500	2500±500
Operating Performance	Part A:Part (By weight)	1:1
	Viscosity after mixing (cps)	2000~3000
	Operating Time (min)	120
	Curing Time (min, 25°C)	480
	Curing Time (min, 80°C)	20
After Curing	Hardness (shore A)	55±5
	Heat Conductivity [W(m·K)]	≥0.8
	Dielectric Strength(kV/mm)	≥25
	Permittivity(1.2MHz)	3.0~3.3
	Volume Resistance(Ω·cm)	≥1.0×1016
	Linear Expansion Coefficient [m/(m·K)]	≤2.2×10-4
	Fire Resistance	UL 94-V1

Warm Tips:
1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas.

lCondensation silicone which not completely cured or organic tin compounds

lSulphur, sulfide and sulfur rubber materials.

lAmine compounds as well as contains the amine materials.

lPewters solder flux.
2. Should be sealed storage.The mixture should be used up at once, avoid causing waste.

3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes.

4. When it gets stratified after a period of storage, Please mix 9301 evenly before using, it does not affect the performance.

PACKAGE:
20Kg/pail (Part A10Kg + Part B10Kg)

SHELF LIFE AND TRANSPORTATION:

1. Twelve(12) months from date of shipment when stored at 24C in original unopened packages.

2. This kind of product is non-dangerous product, it can be transported as general chemicals.

3. Products exceed the storage life should be confirmed normal before using

easy to operate addition silicone for electronic compound