electronic potting compound(addtion cure silicon)

FOB Price
  • US $16.30

    200 - 40,000 kilogram

  • US $9.50

    40,001 - 999,999 kilogram

  • group nameelectronic potting silicone rubber

  • Min Order200 kilogram

  • brand nameHong Ye silicone rubber

  • modelhy9055

  • payment methodT/T, L/C, Westem Union

  • update timeFri, 08 Nov 2013 21:16:04 GMT

Paramtents

  • color gray white fluid

  • mixed viscosity 2000-3000

  • mix ratio 1;1

  • operating time 60-120mins

  • curing time 8 hrs 25t degree

  • hardness 55+5

  • fire resistance ul94-v1

  • dielectric permittivity 3.0-3.3

  • technical support

  • origin china

Packging & Delivery

  • Min Order200 kilogram

Briefing

HY 9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducti

Detailed

    electronic potting compound(addtion cure silicon)  

 

Product Feature of electronic potting compound(addtion cure silicon)
HY 9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate)
,PP,ABS,PVC, etc. and metal materials.

 electronic potting compound(addtion cure silicon)

electronic potting compound(addtion cure silicon)

 

 

Technical Parameters

 

Features

Part A

Part B

Before Curing

Appearence

Gray Fluid

White Fluid

Viscosisty(25°Ccps)

2500±500

2500±500

Operation features

Mixing Ratio

1:1

Viscosisty(after mixing) (cps)

2000~3000

Operating Time(25°C  hr)

120

Curing time (min,25°C)

480

Curing time(80°C  hr)

20

 

 

After Curing

Hardness(Shore  A)

55±5

Thermal conductivity [W(m·K)]

0.8

Dielectric Strength(KV/mm)

25

Permittivity(1.2MHz)

3.0~3.3

Volume Resisivity(Ω·cm)

1.0×1016

linear expansibility [m/(m·K)]

2.2×10-4

Fire Resistance   

94-V1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

packing of electronic potting compound(addtion cure silicon)

electronic potting compound(addtion cure silicon)

 

company of electronic potting compound(addtion cure silicon)

electronic potting compound(addtion cure silicon)

 

 

contact with omiga 

 

Mobile:86-18938867575

 

TEL: 86-0755-89948294

 

 

E-mail:hyjw(at)szrl(dot)net

 

 

 

Nearest port for product export
Shenzhen, Guangzhou, Xiamen, Shanghai
Delivery clauses under the trade mode
FOB, CFR, CIF
Acceptable payment methods
T/T, L/C, Westem Union
Export mode
Export through agents
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