200 - 40,000 kilogram
40,001 - 999,999 kilogram
group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY-9060 silicone
payment methodT/T, L/C, Westem Union
update timeSat, 09 Nov 2013 12:55:30 GMT
color transparent/black
certificate ISO9001:2000
Min Order200 kilogram
HTV addition electronic potting silicone rubber Features
HTV addition electronic potting silicone rubber HY-9060# is a two-component silicone rubber with low viscosity, which can be cured both at room temperature and high temperature.
HTV electronic potting silicone rubber HY-9060# works on the surface of material as PC(Poly-carbonate), PP, ABS, PVC as to its superior bonding feature, and it is also applicable for insulation, waterproof, bonding of electronics parts.
HTV electronic potting silicone rubber HY-9060# meets the requirements of European RoHs.
HTV addition electronic potting silicone rubber Typical Application
- High-power electronic component.
- Power module and printed circuit board request thermal conductivity and high temperature.
HTV addition electronic potting silicone rubber Warm Tips
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-9060# evenly before using,
it does not affect the performance.
4. HY-9060# won't be cured when mixed with some chemical material, so pls avoid contacting the following chemical materials
A. Organice tin compounds and silicone rubber with organotin
B. Materials with sulfur, sulfide
C. Materials with amine
The datasheet of HTV addition electronic potting silicone rubber 9055
model | HY-9055 | |
Before Curing | Appearence | A: Dark gray fluid B: White fluid liquid |
Viscosisty cP | A: 2500±500 B: 2500±500 | |
Operating Perform ance | A:B(w/w) | 1:1 |
Mixing Ratio cP | 2000~3000 | |
Pot life min | 120 | |
Curing time (25°C) min | 480 | |
Curing time (80°C)min°C)min | 20 | |
After Curing | Hardness(Shore (Shore A) | 55±5 |
Thermal conductivity w/mK | ≥0.8 | |
Absolute degree Of dielectric kv/mm | ≥25 | |
Permittivity kv/mm | 3.0~3.3 | |
Volume Resistanc Ω·cm | ≥1.0×1014 | |
Linear expansion coefficient m/mK | ≤2.2×10-4 | |
Flame Resistance | UL94V1 |
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