Flex Circuit Board Assembly Services︱flexible circuitry
group nameSingle Sided Flexible PCB Manufacturing
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Min Order1 piece
brand namePCBQuick PCB Manufacturing and Assembly
modelKF-flexible pcb-07
payment methodL/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
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update timeFri, 26 Apr 2024 05:21:40 GMT
Paramtents
Material Dupont PI
Baord Thickness 0.1mm-0.8mm
Layer 1-8Layers
Silkscreen Color White, Black, Yellow
Copper Thickness 0.5OZ-2.0OZ
Packging & Delivery
Min Order1 piece
Briefing
Flexible PCB assembly (ICs, Processors, MEMS, Passives, SiC, etc.) on to flexible circuits.flexible circuit manufacturer
Detailed
PHYSICAL ADVANTAGES FOR FLEX
- ●More flexibility, as the name suggests.
- ●Improved resistance to vibrations and movement; lower mass/weight.
- ●Small package size.
- ●Allows the board to bend to its desired applicable shape.
- ●Allows for more compact devices.
- ●High tensile strength—can be significantly warped/deformed without breakage.
- ●High bendiness—up to 360 degrees.
- ●Easier to prepare for harsh environments.
- ●The use of flexible flat cables (FCC), which can bend without being damaged, and takes up less space than traditional wires
MANUFACTURING & ASSEMBLY ADVANTAGES
●Increase in design freedom.
- ●Installation flexibility.
- ●Increased reliability and durability.
- ●Improved heat dissipation.
- ●Improved airflow.
| Quality Grade | Standard IPC 2 | Material | DuPont PI, Domestic Shengyi PI | |||
| Number of Layers | 1 - 8layers | Board Size | Min 6*6mm, Max 406*610mm | |||
| Order Quantity | 1pc - 10000+pcs | Board Thickness | 0.1mm - 0.8mm | |||
| Build Time | 2days - 5weeks | Copper Weight (Finished) | 0.5oz - 2.0oz | |||
| Min Tracing/Spacing | 3mil/3mil | Silkscreen Sides | As per the file | |||
| Solder Mask Sides | As per the file | Silkscreen Color | White, Black, Yellow | |||
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow | Surface Finish | HASL - Hot air solder leveling | |||
| Solder-stop coating---Soldermask oil | Green, White, Blue, Black, Red, Yellow | Lead - free HASL - RoHS | ||||
| Solder-stop coating---Coverlay | PI and PET film | ENIG - RoHS | ||||
| Min Annular Ring | 4mil | Immersion Tin - RoHS | ||||
| Min Drilling Hole Diameter | 8mil | OSP - RoHS | ||||
| Min. hole size---Drilling (PTH) | 0.2mil | Other Techniques | Peelable solder mask | |||
| Min. hole size---Punching (NPTH) | 0.5mil | Gold fingers | ||||
| Tolerance of dimension | ±0.05mm | Stiffener (only for PI/FR4 substrate) | ||||
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