Addition cure encapsulant and potting compound

Name :

addition cure encapsulant and potting compound

Number of Addition cure encapsulant and potting compound

HY-9301

Usage of Addition cure encapsulant and potting compound :

Filling for LED,LCD electronic display,circuit board.

Applications of Addition cure encapsulant and potting compound :

it is applicable to sealing, bonding ,coating for electronic parts.

HY-9301 is two-component addition cure silicone rubber which can be divided int a transparent type and a flame resistant type.the product,which can be valcanized under room temperature or moderate temperature with low viscosity,easy mixing and pouring,is applicable to bulk pouring with excellent electrical performance.

Features of Addition cure encapsulant and potting compound :

the product has low shrinkage and non-corrosive,the silicone rubber can be used for long period at the temperature of -60---200 degree celsius with the characteristics of moisture-proof and waterproof,radiation-proof as well as weatherable and anti-ageing.

(note:valcanizing under the room temperature or heat curing according to different requirements.)

Using instruction of Addition cure encapsulant and potting compound :

1.mix the component A and component B evenly according to the proportion and can be used after deaired.

2.the vulcanizing time depends on the temperature in case of heat curing is required,the higher the temperature,the shorter the valcanizing time,and the thicker the product,the longer the time.

3.the flame resistant type silicone may produce deposit after long-time placement,mix the component A and component B respectively and evenly according to the proportion before using.

Standard Datasheet: of Addition cure encapsulant and potting compound