200 - 40,000 kilogram
40,001 - 999,999 kilogram
group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
model9055/9060
payment methodT/T, L/C, Westem Union
update timeFri, 08 Nov 2013 19:50:49 GMT
Sample available
Mixing Ratio 1:1/ 10:1
Color dark grey/ black silicone rubber
Appearance Grey
Hardness(Shore A) 60±5
Curing time (min,25°C) 480
Fire Resistance 94-V0
Packaging Details 25kg/drum and 200kg/drum
Delivery Time within 3 days after payment confirmed in our bank
Payment Terms L/C at sight, T/T, West Union
Min Order200 kilogram
1. Product Feature of Silicone Encapsulants and potting compounds
Silicone Encapsulants and potting compounds have particular inherent physical properties including:
2. Typical Application of Silicone Encapsulants and potting compounds
HY-9060# is suitable for
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
3. Technical Parameters of Silicone Encapsulants and potting compounds
Features | Part A | Part B | |
Before Curing | Appearance | Grey Fluid | White Fluid |
Viscosisty(25°Ccps) | 3000±500 | 3000±500 | |
Operation features | Mixing Ratio | 1:1/ 10:1 | |
Viscosisty(after mixing) (cps) | 2500~3500 | ||
Operating Time(25°C hr) | 120 | ||
Curing time (min,25°C) | 480 | ||
Curing time(80°C hr) | 20 | ||
After Curing | Hardness(Shore A) | 60±5 | |
Thermal conductivity [W(m·K)] | ≥0.8 | ||
Dielectric Strength(KV/mm) | ≥25 | ||
Permittivity(1.2MHz) | 3.0~3.3 | ||
Volume Resisivity(Ω·cm) | ≥1.0×1016 | ||
linear expansibility [m/(m·K)] | ≤2.2×10-4 | ||
Fire Resistance | 94-V0 |
(Pls note: the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers to when using.)
4. TECHNICAL GUIDELINES of Silicone Encapsulants and potting compounds
1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.
2, Weight Ratio: part A: part B = 1:1
3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.
4, The temperature influences the curing time of HY-9060#. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. Suggested operation time and temperature. With temperature of 80~100°C, the silicone will cure in 15 minutes, while in 25°C room temperature, the silicone will cure around 8 hours.
5. Warm Tips of Silicone Encapsulants and potting compounds
1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas.
lCondensation silicone which not completely cured or organic tin compounds
lSulphur, sulfide and sulfur rubber materials.
lAmine compounds as well as contains the amine materials.
lPewters solder flux.
2. Should be sealed storage.The mixture should be used up at once, avoid causing waste.
3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes.
4. When it gets stratified after a period of storage, Please mix 9060 evenly before using, it does not affect the performance
If you have any questions with Silicone Encapsulants and potting compounds,pls feel free to contact Ms Aimee
MSN: aimeezhou055722(at)hotmail(dot)com
Skype:aimee055722
Email:hysz(at)szrl(dot)net
Tel:0086-755-89948019
Mob: 086-18938867541
Trademanager:cn200039753
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