supply Addition cure liquid encapsulant and potting silicone

FOB Price

US $14.20
200 - 40,000 kilogram
US $10.20
40,001 - 999,999 kilogram

group nameelectronic potting silicone rubber
Min Order200 kilogram
brand nameHong Ye silicone rubber
modelHY-9055 silicone
payment methodT/T, L/C, Westem Union
update timeSat, 09 Nov 2013 12:39:43 GMT

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Paramtents

Type Gelatin
certificate ISO9001:2000

Packging & Delivery

Min Order200 kilogram

Briefing

moderate viscosity
easy operation
resistance to deformation
good tensile strength
nontoxic and durable.

Detailed

Features & Applications Addition cure encapsulant and potting silicone

HY 9055 is addition silicone potting compound in two parts with low viscosity.

It can be cured completely at room temperature. HY 9055 works on the surface of material as PC(Poly-carbonate),PP,ABS,PVC as to its superior bonding feature. It is also applicable for insulation, waterproof and bonding of electronics parts. It meets the requirements of European RoHS.

Addition cure encapsulant and potting silicone Typical Application

- Potting for Protetion of general electronic Module.

- Outdoor protection for LED screen.

Addition cure encapsulant and potting silicone TECHNICAL GUIDELINES

1, Please put part A and part B in separate container and stir evenly before mixing the two parts together.

2, Weight Ratio: part A: part B = 10:1

3, Bubble release if necessary. Deaeration the mixture under 0.08 MPa for 3 minutes.

4,HY 9055 is cured at room temperature, so pls put it under room temperature after pouring.It comes to next process when basically cured, and it takes about 24 hours for completely cured.

Kindly note: Temperature and Humidity with a tremendous influences for curing of HY 210.

Datasheet of Addition cure encapsulant and potting silicone

Model	HY-9055
Type	General purpose
Component	A	B
Appearance(liquid)	Gray	White
Mixing ratio(%)	1	1
Viscosity (Pa.s)	2.5±0.5
Pot life in 25°C(min)	60~90
Curing time(min)	180 in 25°C or 20 in 80°C
Hardness (shore A°)	55±5
Volume resistivity (Ω)	≥1.0×10¹⁵
Dielectric constance(1.2MHz)	3.0~3.3
Dielectric strength (kv/m^-1)	≥25
Temperature resistance (°C)	-60~200
Flame retardant	UL94-V1