Multilayer HDI PCB with Micro BGA Assembled

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  • Min Order1 piece

  • brand name86PCB

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  • update timeThu, 10 May 2018 13:16:47 GMT

Paramtents

  • Board Material : KB FR4 TG170

  • Thickness: 1.0mm

  • Size: 50*25mm

Packging & Delivery

  • Min Order1 piece

Briefing

Multilayer HDI PCB With Micro BGA Assembled For Smart Boots

Detailed

Specification

Board Material:  KB FR4 TG170

Board Thickness:  1.0mm

Size:  50*25mm

Layer:  6 Layer

Copper Thickness:  1OZ

Surface Finishing:  ENIG

Solder Mask:  Green

Silkprint:  White


Core part


This PCBA is for a high-tech innovation product smart boots. PCB is 6 layer HDI PCB with blind holes,very small size and irregular shape. There are total 9 BGA on this board, all of them are mini BGA. The minimum distance between ball centre  is 0.4mm,minimum distance between ball edge is 0.15mm. There are two BGA with 4 balls,which needs rich experience and sophisticated SMT equipment to do this assembly work. 

Test & Inspection

To ensure the assembly quality , X-RAY test is necessary. And the result is very good, all of those BGA are asembled perfectly . 

Xray test

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