One-step forming of fine slits and micropores
Etching minimum line width/gap can be 0.02 - 0.05 mm, dense array and profile is not limited by the mold.
Etched EMI / RFI Shielding Component — Custom RFI Shielding Component
group nameEMI & RFI Shields
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Min Order1 piece
brand nameMicroEtch
payment methodT/T, L/C, PayPal, Westem Union
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update timeTue, 20 Oct 2026 09:36:01 GMT
Paramtents
Material nickel silver (C7701), SUS304 / SUS301 stainless steel…
Specifications 0 mould fee ｜ 0.02 mm ｜ 24 hours; etching tolerance ±0.01 mm…
Function Multi-cavity fine-slot shields etched in one pass with stable shielding effectiveness and a close…
Application RF and communication device makers / Consumer and automotive electronics / Semiconductor packagers
Industries Electronics / communication / automotive / semiconductor industry
Business Model OEM / ODM custom manufacturing from drawings; sample to volume production
Business Type OEM / ODM Manufacturer
Packging & Delivery
Min Order1 piece
Briefing
Multi-cavity fine-slot shields etched in one pass with stable shielding effectiveness and a close fit
Detailed
Etched EMI / RFI Shielding Component for OEM / ODM Programs
Etched EMI / RFI Shielding Component — Custom RFI Shielding Component
EMI / RFI Shielding Component is a precision metal part with micro-apertures, fine slots or custom geometry formed directly into nickel silver (C7701), SUS304 / SUS301 stainless steel, beryllium copper — selected by shielding and spring requirements by photo-chemical etching — integrally formed and tooling-free. Its purpose is straightforward: multi-cavity fine-slot shields etched in one pass with stable shielding effectiveness and a close fit.
What is it? Multi-cavity fine-slot shields etched in one pass with stable shielding effectiveness and a close fit Typical uses: RF and communication device makers / Consumer and automotive electronics / Semiconductor packagers
0 mould feeOptical film — revisions need no tooling
24 hoursSample turnaround
±0.01 mmnickel silver (C7701), SUS304 / SUS301 stainless steel…
Why specify etched EMI / RFI Shielding Component
Turn Your EMI / RFI Shielding Component Requirement into a Manufacturable Part
Side wall vertical without burrs
Non-contact chemical cold working, no stamping shear and collapse edge, avoid short circuit, scratch and poor contact.
Etching + stamping composite
Etching first, bending, pressing, half shearing, shielding cavity and buckle can be completed on the same part at one time.
Product specification
Core Details for Sourcing Review
| Product type | Etched EMI / RFI Shielding Component |
|---|---|
| Materials | nickel silver (C7701), SUS304 / SUS301 stainless steel… |
| Process | Photo-chemical etching, integrally formed |
| Specifications | 0 mould fee ｜ 0.02 mm ｜ 24 hours; etching tolerance ±0.01 mm… |
| Function | Multi-cavity fine-slot shields etched in one pass with stable shielding effectiveness and a close… |
| Applications | RF and communication device makers / Consumer and automotive electronics / Semiconductor packagers |
| Industries served | Electronics / communication / automotive / semiconductor industry |
| Business model | OEM / ODM custom manufacturing from drawings; sample to volume production |
| Tooling | Optical film based — no mould fee for design revisions |
| Sampling | Sample issued within 24 hours. 5–15 days for volume production |
Send us the machine model and shielding position, outline, cavity height and assembly method, shielding effectiveness target, plating and soldering requirements. We will recommend material, geometry and process, and issue a sample for validation.
Built around B2B buying paths
Support for OEM, Brand and Distribution Programs
RF and communication device makers
fine slots, micro-holes and custom cavities etched in one pass, samples within 24 hours.
Consumer and automotive electronics
etching combined with pressing for bent, dimpled and clipped parts, no outsourcing.
Semiconductor packagers
Kovar, nickel silver and beryllium copper processed to hermeticity and plating requirements.
Send your drawing and requirement
Get EMI / RFI Shielding Component Samples in 24 Hours
Send us the machine model and shielding position, outline, cavity height and assembly method, shielding effectiveness target, plating and soldering requirements. We will recommend material, geometry and process, and issue a sample for validation.
Start with the material grade, thickness and tolerance your application requires.
- Sample issued within 24 hours
- 5–15 days for volume production
- No MOQ — prototype and small batches accepted
Buyer FAQ
Questions Buyers Ask Before Enquiry
How fine can slots and hole arrays be?
0.05 mm typical, down to 0.02 mm at the limit, depending on material thickness.
What about bends and clips?
Parts are etched first and then pressed, so bends, dimples, half-shears and clips are all produced in one flow.
Can you process Kovar or beryllium copper?
Yes. Kovar, beryllium copper, nickel silver and SUS301 are all in regular production; sample first to validate.
Which plating should we choose?
Tin or nickel for solderable areas; gold for contact and conduction surfaces — tailored to salt-spray and contact-resistance requirements.
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- Nearest port for product export
- 深圳蛇口
- Delivery clauses under the trade mode
- FOB, EXW
- Acceptable payment methods
- T/T, L/C, PayPal, Westem Union